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XSW-640: High resolution cooled shortwave infrared (SWIR) module

Xenics' XSW-640 OEM module is extremely compact and versatile for easy and swift integration in your SWIR imaging configuration.

Typical OEM applications include infrared imaging for man–portable and unmanned (airborne and land-based) vehicle payloads, night vision, border security, Search & Rescue (SAR) and more.

The XSW-640 OEM module detects short wave infrared radiation between 0.9 (optionally 0.4) and 1.7 μm with a wide dynamic range and wide operating temperature.

The Thermo Electric (TE) stabilization reduces the dark current and noise levels. Together with on-board image processing you will have best contrast and high image quality.

Benefits & features

  • Made in Europe
    Easy to export with dual use export license - no ITAR restrictions
  • High resolution
    640x480 Image resolution
  • Easy connectivity
    Various interfaces available
  • Small 20 μm pixel pitch
    Excellent trade off between sensitivity, noise and format

Designed for use in

  • SWIR sights
    SWIR camera can be used for day and starlight (nightglow) imaging
  • UAV / UGV
    XTM and XSW cores can be used as thermal and electro optical payloads for UAV platforms
  • Border security
    Thermal imager detects heat signature at night. SWIR imager for day and starlight imaging
  • Laser detection
    SWIR camera can be used to detect covert laser (targeting laser, or laser range finder)
  • Night vision (passive & active)
    Thermal imager detects heat signature at night. SWIR imager for day and starlight imaging
  • Search & Rescue
    Thermal imagers are able to detect heat from subject. SWIR images can be illuminated by moonlight and starlight. Essential for night search and rescue operations
  • Driver assistance
    Thermal imager detects heat signature at night. SWIR imager for day and starlight imaging
  • Electro optical payloads
    XTM and XSW cores can be used as thermal and electro optical payloads for UAV platforms
  • Enhanced Vision Systems (EVS)
    Aircraft landing systems based on cooled MWIR cameras with broadband response (1 to 5um)

Features

  • Compatible with a variety of framegrabbers
    Several compatible frame grabbers for CameraLink interface are available (Euresys Grablink Full, NI 1433 and Imperx Framelink Express VCE-CLEX01).
  • SWaP (Small size, weight and power )
    Small volume, low weight and low power consumption for demanding applications
  • Windowing mode
    Imaging in a reduced window of interest for increased frame rates
  • TrueNUC image correction
    Non uniformity correction for a wide range of integration times
  • High dynamic range
    High dynamic range mode available
  • GigE Vision standard compatibility
    The Gigabit Ethernet interface is compatible to the GigE Vision standard
  • Trigger
    External trigger for signal synchronization
  • Video output
    Analog video output available
  • VisNIR option
    Visible enhanced InGaAs available (500 - 1700 nm)
  • Day & Night Vision
    The camera can operate under daylight or nighttime conditions

Camera specifications

Array Specifications

Array Specifications XSW-640
Array type InGaAs Focal Plan Array (FPA) ROIC with CTIA topology
Spectral band 0.9 μm to 1.7 μm (VisNIR optional 0.4 to 1.7 μm)
Resolution 640 x 512
Pixel pitch 20 μm
Readout mode Integrate Then Read (ITR) Integrate While Read (IWR)
Peak Quantum Efficiency (QE) 80% 85%
ROIC noise High gain: 60 e- Low gain: 400 e-
Sensitivity High gain: 20 μV/e- Low gain: 1.6 μV/e-
Dark current 0.8 x 10⁶ e-/s
Integration capacitor High gain: 6.7 fF Low gain: 85 fF
Array cooling TE1-stabilized
Pixel operability > 99 %

Module Specifications

Module Specifications XSW-640- Samtec XSW-640- Analog XSW-640- CL XSW-640- GigE  
Lens
Focal length Broad selection of lenses available
Optical interface Fixation holes for multiple lens mounts
Imaging performance
Maximum frame rate (full frame) 100 Hz 25 Hz (PAL) or 30 Hz (NTSC) 100 Hz
Window of interest Minimum size 32 x 4
Integration time range 1 μs - 40 ms
Noise level: High gain 120 e-
Noise level: Low gain 400 e-
Gain level: High gain 1.28 e-/ADU
Gain level: Low gain 16.2 e-/ADU
On-board image processing Image correction (TrueNUC for high and low gain), Auto-Gain, Auto-Exposure, Histogram-Equalization, Trigger Possibilities Up to 4 NUCs, Auto-Gain, Trigger Possibilities
ADC 14 bit
Interfaces
Digital output BT.601-6/BT.656-5 - CameraLink or Xeneth API/SDK GigE Vision or Xeneth API/SDK
Analog output - PAL or NTSC -
Module control Serial LVCMOS 3 V (XSP) RS232 (XSP) CameraLink GigE Vision
Trigger Trigger in or out (configurable)
Power requirements
Power consumption +/- 2.6 W 3 W 2.8 W 4 W
Power supply 12 V
Physical characteristics
Shock 40 G, 11 ms according to MIL-STD810G
Vibration 5 G (20 Hz to 2000 Hz) according to MIL-STD883J
Operating case temperature -40ºC to 70ºC (industrial components)
Storage temperature range -40ºC to 85ºC (industrial components)
Dimensions (W x H x L mmᵌ) 45 x 45 x 51 45 x 45 x 55 45 x 45 x 65
Weight module 120 g 145 g 129 g 165 g

Media

Brochure XSW-640 (EN)

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