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Xeva 2.35

The Xeva-2.35-320 is a compact digital camera operating a T2SL detector array for imaging in the 1.0 to 2.35 μm wavelength range. The camera features a resolution of 320 x 256 pixels with a 30 μm pixel pitch. It outputs 14-bit data and comes in a 100 Hz (USB 2.0)
or 350 Hz (CameraLink) version.

The camera interfaces to a PC via standard USB 2.0 or CameraLink. Each camera is delivered with a Graphical User Interface (GUI) Xeneth, which offers direct access to various camera settings such as exposure time and operating temperature. The camera allows for exposure times from 1 μs to 60 ms in high dynamic range mode (with TE4 cooling).

Through its advanced thermomechanical design, the Xeva-2.35-320 achieves excellent performance levels using a TE4-cooled device operating down to 203K.

Benefits & features

  • Flexible programming in an open architecture
    SDK (Software Developing Kit) available for all cameras - samples available for C++, LabView, Linux...
  • Spectrometer compatible
    The Xeva-2.35-320 cameras have mounting holes for spectrographs, making them suitable for (hyper)spectral imaging applications
  • Smallest TE4-cooled camera
    The Xeva-2.35-320 is a very small TE4 cooled T2SL camera with low dark current and response up to 2.35 µm
  • High speed SWIR imaging up to 2.35 µm
    The Xeva-2.35-320 allows for high frame rate imaging up to 344 full frames per second - in a reduced window of interest, even higher frame rates are possible
  • Scientific image recording and analysis
    Our standard Xeneth GUI allows for easy recording of images in full (bit) resolution
  • CameraLink and triggering for high speed imaging
    CameraLink interface is suitable for high datarates - triggering can be used for synchronisation at high frame rates

Designed for use in

  • Art inspection
    SWIR photons can penetrate through paint, hence underdrawings can be investigated
  • Hyperspectral imaging
    Combination of spectral imaging and 2D imaging. Our SWIR camera are used for hyperspectral SWIR imaging
  • R&D (SWIR range)
    SWIR range is a relatively unexplored range and hence providing much research opportunities
  • Laser beam profiling
    Laser beam analysis for infrared lasers at, e.g., 1064, 1300 and 1550 nm
  • Semiconductor inspection
    SWIR cameras are able to see through silicon
  • High temperature thermography (in the 300˚ C- 1200˚ C range or up to 2000˚ C)
    SWIR cameras can be used for thermal imaging in the temperature range above 300 degrees C

Features

  • 2 years warranty
    Xenics offers standard 2 years warranty
  • IR camera software included
    Xeneth camera control and imaging software is included
  • Windowing mode
    Imaging in a reduced window of interest for increased frame rates
  • High speed
    High frame rate imaging at more than 344 fps in full frame
  • High dynamic range
    High dynamic range mode available
  • Compatible with a variety of framegrabbers
    Several compatible frame grabbers for CameraLink interface are available
  • Trigger
    External trigger for signal synchronization
  • Multi-stage cooling
    Thermo-electric or Peltier cooling in 4 stages
  • Spectrograph compatible
    Mounting holes available for spectrograph mounting

Camera specifications

Array Specifications

Array SpecificationsXeva-2.35-320
Array type T2SL
Spectral band 1.0 μm to 2.35 μm
Resolution 320 x 256
Pixel pitch 30 μm
Array size W: 9.6 mm; H: 7.68 mm; D: 12.29 mm or 0.48 in
Dark current 20 - 40 x 10x6 e-/s
ROIC noise High gain: 70 electrons; Low gain: 700 electrons
Integration capacitor High gain: 10 fF; Low gain: 210 fF
Full well capacity High gain: 0.17 x 10x6 electrons; Low gain: 3.5 x 10x6 electrons
Array cooling TE4-cooled
Pixel operability > 99 %

Camera Specifications

Camera Specifications100 Hz350 Hz
Lens
Focal length 16 mm f/1.4
Optical interface C-Mount with filter holder
Imaging performance
Maximum frame rate (full frame) 100 Hz 344 Hz
Window of interest No Minimum 128 x 8
Integration type Snapshot
Exposure time range High gain: 1 μs to > 3 ms; HDR: 1 μs to > 60 ms
Noise High gain: 150 electrons; HDR: 1000 electrons
Gain High gain: 10 electrons/ADU; HDR: 210 electrons/ADU
ADC 14 bit
Interfaces
Camera control USB 2.0
Image acquisition USB 2.0 or CameraLink CameraLink
Trigger TTL levels
Power requirements
Power consumption 7W without cooling; 84 Watt @ maximum cooling
Power supply 24 V
Physical characteristics
Camera cooling Forced convection cooling
Cool-down time Approximately 2 minutes
Ambient operating temperature range 0 to 40 °C
Dimensions (W x H x L mmᵌ) 87 x 115 x 109
Weight camera head +/- 1.8 kg

Brochure Xeva-2.35-320

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